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| Subject: Lead free soldering mods... | |
Author: Peter Thornton | [ Next Thread |
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] Date Posted: 08:46:30 01/31/04 Sat Research is presently underway at the Equipment Engineering Co. to discover if some coatings would be suitable, viable and reliable to enable existing solder pots to be used for lead free alloys. Initial tests on silicon carbide, silicon nitride and amorphous vitrified silicon are presently undergoing accelerated strees testing at 500deg.C in a nitrogen cover gas mini solder pot. The temperature at 500deg.C causes the tin in the alloys to be extremely aggressive; any weakness in the coating will be seen in hours rather than months. Various alloys are under consideration, as are various contamiants to see if the prescence of minute amounts of lead (i.e. from 60/40 plated component leads, for instance). The results will be posted here as soon as definitive answes are available. Watch this space!! [ Next Thread | Previous Thread | Next Message | Previous Message ] |